Product Details

High-quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colorful non-woven material, suitable for polishing, ensures process safety. Compression hardness: 10. Abrasiveness: 5.

Specifications

• Brand
  Koch-Chemie
• Manufacturer #
  999585
• Item #
  KOC-999585
• UPC
  4260188687288
• Material
  Foam
• Pad Face Size
  6.5"
• Pad Backing Size
  6"
• Attachment Type
  Hook and Loop

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